ATE534500T1

Methods of forming molds and methods of forming articles using said molds

Abstract

A method of forming a working mold including placing a substrate near an electrode in a chamber, the substrate (610) having at least a first structured surface (620); providing power to the electrode to create a plasma, —introducing vapor of liquid silicone molecules into the plasma; and depositing a release layer (630), the release layer (630) including a silicone containing polymer, the release layer (630) being deposited on at least a portion of the first structured surface of the substrate to form the working mold.

Term

1.9 yearsto projected expiry

Projected expiry 5 September 2028, counted from filing; an application has no term until it is granted.

  1. Priority
  2. Filed
  3. Published
  4. Today
  5. Projected expiry

19 members in 6 offices

This recordMember, by publication datePriority claim

Priority claims2

Priority claims
DocumentOfficeKindDate
96763207United States of AmericaP
2008075412United States of AmericaW

Members19

Family members, oldest first
DocumentOfficeKind
WO2009033017A1World Intellectual Property Organization (WIPO)A1
WO2009033029A1World Intellectual Property Organization (WIPO)A1
EP2197645A1European Patent Office (EPO)A1
EP2197646A1European Patent Office (EPO)A1
CN101795838AChinaA
CN101795840AChinaA
US2010239783A1United States of AmericaA1
JP2010537867AJapanA
JP2010537868AJapanA
US2010308509A1United States of AmericaA1
EP2197646B1European Patent Office (EPO)B1
AT534500TAustriaT
ATE534500T1This recordAustriaT1
JP5161310B2JapanB2
CN101795840BChinaB
CN101795838BChinaB
EP2197645B1European Patent Office (EPO)B1
US9102083B2United States of AmericaB2
US9440376B2United States of AmericaB2