Nova Patents
ATE488982T1

Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors

Abstract

Solder paste application, inspection and correction. Following or during application of solder paste on a substrate, the result thereof is inspected and any detected errors are registered. Following an evaluation as to whether correction of these errors is required and if it would be worthwhile, the errors are corrected. The correction involves removing solder paste from locations where so required, and jetting of additional solder paste to locations where so required.

Term

Term ended

Projected expiry passed 6 July 2021, 5.2 years ago.

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18 members in 10 offices

This recordMember, by publication datePriority claim

Priority claims2

Priority claims
DocumentOfficeKindDate
0002618SwedenA
0101566SwedenW

Members18

Family members, oldest first
DocumentOfficeKind
WO0205607A1World Intellectual Property Organization (WIPO)A1
AU6801001AAustraliaA
US2002014602A1United States of AmericaA1
SE518642C2SwedenC2
KR20030016389ARepublic of KoreaA
EP1308072A1European Patent Office (EPO)A1
CN1442030AChinaA
JP2004502538AJapanA
CN1269389CChinaC
US2006275538A1United States of AmericaA1
US7201802B2United States of AmericaB2
KR100796875B1Republic of KoreaB1
EP1308072B1European Patent Office (EPO)B1
AT488982TAustriaT
ATE488982T1This recordAustriaT1
DE60143485D1GermanyD1
US7931933B2United States of AmericaB2
JP4917236B2JapanB2