ATE464362T1

Method and apparatus for bonding and debonding adhesive interface surfaces

Abstract

The present invention relates to a system and a method of improving the debonding of two or more surfaces together. The invention utilises thermoexpanadable microspheres and thermal energy to debond interfaces in an adhesive system or as vehicle carriers. It also discloses a method of curing the adhesive system prior to the debonding step so that the same adhesive system may be used for both phases. It is especially useful in the automotive industry for end of vehicle life dismantling.

Term

Term ended

Projected expiry passed 31 March 2024, 2.5 years ago.

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18 members in 11 offices

This recordMember, by publication datePriority claim1 more office is in the list below

Priority claims3

Priority claims
DocumentOfficeKindDate
0307504United KingdomA
0325658United KingdomA
2004001366United KingdomW

Members18

Family members, oldest first
DocumentOfficeKind
WO2004087826A2World Intellectual Property Organization (WIPO)A2
WO2004087826A3World Intellectual Property Organization (WIPO)A3
KR20050116838ARepublic of KoreaA
EP1608717A2European Patent Office (EPO)A2
MXPA05010694AMexicoA
CN1795247AChinaA
JP2006522197AJapanA
US2006219350A1United States of AmericaA1
WO2004087826A9World Intellectual Property Organization (WIPO)A9
CN100591738CChinaC
EP1608717B1European Patent Office (EPO)B1
AT464362TAustriaT
ATE464362T1This recordAustriaT1
DE602004026564D1GermanyD1
ES2343888T3SpainT3
PL1608717T3PolandT3
US7901532B2United States of AmericaB2
EP1608717B2European Patent Office (EPO)B2