A modular board to board mezzanine connector system and method of making said connector system to a desired stack height
Abstract
A modular board to board ball grid array BGA connector includes a plug (12), a receptacle (13) and if needed an adapter (110). The plug (12) and the receptacle (13) can be made from the same base pieces to accommodate different stack heights. If a greater stack height is needed, spacers (20) can be used in the plug (12) and the receptacle (13) to accommodate a greater selected stack height. The plug (12) and the receptacle (13) both include a base (14) having interstitial diamond recesses (22) in which the solder balls (29) are disposed and in which one end of a contact (59, 61) is inserted. The plug may further include a plug cover (18) that can be connected to the base (14), and the receptacle may include a receptacle cover (70) that fits over its base (14). The plug can have a plug contact assembly (16), and the receptacle can have a receptacle contact assembly (72). The plug and the receptacle can be mated by mating the plug cover (18) to the receptacle cover (70) and the receptacle contacts (84, 86) to the plug contacts (59, 61). If a larger stack height is desired, a spacer (20) can be attached to the base of either or both the plug or the receptacle to achieve a larger stack height.
Term
Term ended
Projected expiry passed 25 July 2022, 4.2 years ago.
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- Filed
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- Projected expiry
- Today
34 members in 12 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 91932101 | United States of America | A |
Members34
| Document | Office | Kind | |
|---|---|---|---|
| HU0202292D0 | Hungary | D0 | |
| CA2394432A1 | Canada | A1 | |
| US2003027439A1 | United States of America | A1 | |
| EP1283559A2 | European Patent Office (EPO) | A2 | |
| CN1400688A | China | A | |
| JP2003132992A | Japan | A | |
| HU0202292A2 | Hungary | A2 | |
| HU0900349A2 | Hungary | A2 | |
| HUP0202292A2 | Hungary | A2 | |
| HUP0900349A2 | Hungary | A2 | |
| EP1283559A3 | European Patent Office (EPO) | A3 | |
| TW571470B | Taiwan Province of China | B | |
| HU0202292A3 | Hungary | A3 | |
| HUP0202292A3 | Hungary | A3 | |
| US2004161954A1 | United States of America | A1 | |
| EP1494320A1 | European Patent Office (EPO) | A1 | |
| US2005032437A1 | United States of America | A1 | |
| US6869292B2 | United States of America | B2 | |
| EP1283559B1 | European Patent Office (EPO) | B1 | |
| AT305176T | Austria | T | |
| ATE305176T1This record | Austria | T1 | |
| SG118146A1 | Singapore | A1 | |
| DE60206228D1 | Germany | D1 | |
| ES2246364T3 | Spain | T3 | |
| CN1738099A | China | A | |
| CN1244184C | China | C | |
| DE60206228T2 | Germany | T2 | |
| US7407387B2 | United States of America | B2 | |
| JP4142367B2 | Japan | B2 | |
| US7429176B2 | United States of America | B2 | |
| HU227144B1 | Hungary | B1 | |
| MY142558A | Malaysia | A | |
| EP1494320B1 | European Patent Office (EPO) | B1 | |
| HU230526B1 | Hungary | B1 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 2016345
Titles2
- German
- MODULARES, ANPASSUNGSFÄHIGES STECKVERBINDERSYSTEM UND HERSTELLUNGSVERFAHREN
- English
- MODULAR, ADAPTABLE CONNECTOR SYSTEM AND MANUFACTURING PROCESS
Classification
- CPC, 4
- H01R33/7671
- H01R13/506
- H01R12/707
- H01R12/716
- IPC, 7
- H01R24 00
- H01R12 50
- H01R12 70
- H01R12 71
- H01R13 506
- H01R13 514
- H01R33 76