ATE215420T1
Apparatus for chemical mechanical polishing of wafers
Abstract
This record has no abstract on file.
Term
Term ended
Projected expiry passed 28 July 2017, 9.2 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
13 members in 7 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 19632809 | Germany | A |
Members13
| Document | Office | Kind | |
|---|---|---|---|
| EP0824053A1 | European Patent Office (EPO) | A1 | |
| DE19632809A1 | Germany | A1 | |
| JPH1080858A | Japan | A | |
| KR19980018700A | Republic of Korea | A | |
| US5964652A | United States of America | A | |
| TW436373B | Taiwan Province of China | B | |
| EP0824053B1 | European Patent Office (EPO) | B1 | |
| AT215420T | Austria | T | |
| ATE215420T1This record | Austria | T1 | |
| DE59706834D1 | Germany | D1 | |
| DE19632809C2 | Germany | C2 | |
| KR100420300B1 | Republic of Korea | B1 | |
| JP3881433B2 | Japan | B2 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased due to non-payment of the annual feeCeasedREN | REN |
Numbers
- Application
- 97112960
Titles2
- English
- DEVICE FOR CHEMICAL-MECHANICAL POLISHING OF WAFERS
- German
- GERÄT ZUM CHEMISCH-MECHANISCHEN POLIEREN VON WAFERN
Classification
- CPC, 7
- B24B37/24
- H10P52/00
- B24B37/20
- B24B37/26
- B24B37/30
- B24B41/068
- B24D9/04
- IPC, 6
- B24B7 22
- B24B19 02
- B24B37 04
- B24B41 06
- B24D9 04
- H01L21 304