AT89337T

Electroplating bath and process for maintaining plated alloy composition stable.

Abstract

This record has no abstract on file.

Term

No projected expiry on record.

  1. Priority and filed
  2. Granted
  3. Today

30 members in 11 offices

This recordMember, by publication date1 more office is in the list below

Members30

Family members, oldest first
DocumentOfficeKind
US4743346AUnited States of AmericaA
US4846941AUnited States of AmericaA
US4849303AUnited States of AmericaA
EP0329877A1European Patent Office (EPO)A1
EP0335683A2European Patent Office (EPO)A2
AU3222989AAustraliaA
WO8910626A1World Intellectual Property Organization (WIPO)A1
AU3551089AAustraliaA
KR890016216ARepublic of KoreaA
EP0335683A3European Patent Office (EPO)A3
JPH0277595AJapanA
JPH0317915B2JapanB2
AU612808B2AustraliaB2
CA1310699CCanadaC
EP0329877B1European Patent Office (EPO)B1
AT89337TThis recordAustriaT
DE3881022D1GermanyD1
MX171182BMexicoB
DE3881022T2GermanyT2
EP0335683B1European Patent Office (EPO)B1
AT96185TAustriaT
DE68909984D1GermanyD1
US5278891AUnited States of AmericaA
DE68909984T2GermanyT2
US5408515AUnited States of AmericaA
US5438610AUnited States of AmericaA
KR960015548B1Republic of KoreaB1
US5651050AUnited States of AmericaA
HK1000381A1Hong Kong, ChinaA1
HK1000382A1Hong Kong, ChinaA1