AT75900T
Device and process for mounting components on printed-circuit boards
Abstract
This record has no abstract on file.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
5 members in 4 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 3738152 | Germany | A |
Members5
| Document | Office | Kind | |
|---|---|---|---|
| EP0315799A1 | European Patent Office (EPO) | A1 | |
| US4875285A | United States of America | A | |
| EP0315799B1 | European Patent Office (EPO) | B1 | |
| AT75900TThis record | Austria | T | |
| DE3870811D1 | Germany | D1 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Cancelled due to lapse of timeLapsedEELA | EELA |
Numbers
- Application
- 88117266
Titles2
- German
- VORRICHTUNG UND VERFAHREN ZUM BESTUECKEN VON LEITERPLATTEN MIT BAUELEMENTEN.
- English
- DEVICE AND METHOD FOR COVERS OF CONDUCTOR PLATES WITH COMPONENTS.
Classification
- CPC, 5
- H05K13/0404
- H05K13/041
- Y10T29/4913
- Y10T29/53178
- Y10T29/53261
- IPC, 1
- H05K13 04