Thermal interface materials and method of making thermal interface materials

In one aspect, the present invention provides a polymeric hot-melt pressure-sensitive adhesive having a number average molecular weight of (A) greater than 25,000; (b) 25% by weight of the polymer or more thermally-conductive filler and melt-blending to form a mixture; (C) it provides a method for producing a hot-melt pressure-sensitive adhesives and heat the thermal interface material including the step of forming the mixture into a film of a conductive filler. In another aspect, the invention provides a flame retardant, and (or) micro-fiber forming material, and (or); Gamma rays or an electron beam is irradiated with a combination of (E-beam) radiation, or both the film may include forming a thermal interface material further.