Nova Patents
AT556434T

Electronic package having a folded flexible substrate and method of manufacturing the same

Abstract

This record has no abstract on file.

Term

Term ended

Expired 22 September 2024, 2 years ago.

  1. Priority
  2. Filed
  3. Granted
  4. Expired
  5. Today

19 members in 10 offices

This recordMember, by publication datePriority claim

Priority claims2

Priority claims
DocumentOfficeKindDate
66850803United States of AmericaA
2004030993United States of AmericaW

Members19

Family members, oldest first
DocumentOfficeKind
US2005062141A1United States of AmericaA1
TW200512922ATaiwan Province of ChinaA
WO2005031865A1World Intellectual Property Organization (WIPO)A1
US6972482B2United States of AmericaB2
US2006008949A1United States of AmericaA1
TWI253162BTaiwan Province of ChinaB
KR20060054466ARepublic of KoreaA
EP1665379A1European Patent Office (EPO)A1
HK1084506AHong Kong, ChinaA
CN1853272AChinaA
US7148087B2United States of AmericaB2
JP2007506285AJapanA
SG146674A1SingaporeA1
KR100893653B1Republic of KoreaB1
JP4503604B2JapanB2
CN1853272BChinaB
EP1665379B1European Patent Office (EPO)B1
AT556434TThis recordAustriaT
ATE556434T1AustriaT1