Nova Patents
AT536263T

Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding

Abstract

An electronic device comprises a first surface and a the substrate 110 including the second surface, the first surface and a the substrate carrier 105 including the second surface, the first of the first surface of the substrate the substrate carrier 105 It comprises an inorganic material 120 to bond to the surface.

Term

Term ended

Expired 4 October 2025, 1 year ago.

  1. Priority
  2. Filed
  3. Granted
  4. Expired
  5. Today

17 members in 8 offices

This recordMember, by publication datePriority claim

Priority claims3

Priority claims
DocumentOfficeKindDate
62206204United States of AmericaP
97714104United States of AmericaA
2005035772United States of AmericaW

Members17

Family members, oldest first
DocumentOfficeKind
AU2005299977A1AustraliaA1
US2006093787A1United States of AmericaA1
WO2006047052A1World Intellectual Property Organization (WIPO)A1
EP1812238A1European Patent Office (EPO)A1
KR20070083885ARepublic of KoreaA
CN101048285AChinaA
JP2008518470AJapanA
US7563691B2United States of AmericaB2
US2009256882A1United States of AmericaA1
AU2005299977B2AustraliaB2
EP2266800A1European Patent Office (EPO)A1
CN101048285BChinaB
EP1812238B1European Patent Office (EPO)B1
AT536263TThis recordAustriaT
ATE536263T1AustriaT1
US8174094B2United States of AmericaB2
KR101232504B1Republic of KoreaB1