Chamber and method for wafer processing

A wafer processing chamber in which a fluid flow and the fluid pressure in the control chamber is provided in a number of ways. Chamber, utilizes a removable plate, which can be configured to control the fluid pressure and fluid flow within the internal volume of the chamber. The removable plates can be used to isolate the internal volume of the chamber and the outer volume of the chamber. In addition, the wafer clamping apparatus for use in the chamber is provided. Wafer clamping apparatus the upper and lower surfaces of the wafer using the pressure differential between said pull the wafer toward the wafer support structure in contact with the wafer bottom surface, and thus the wafer is fixed to a movement disabled state is maintained. In addition, the high-pressure chamber configuration is provided.