AT533180T
Wrap-around overmold for electronic assembly
Abstract
This record has no abstract on file.
Term
2 yearsleft in the term
Expires 12 September 2028.
- Priority
- Filed
- Granted
- Today
- Expires
8 members in 4 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 90104207 | United States of America | A | |
| 2008010689 | United States of America | W |
Members8
| Document | Office | Kind | |
|---|---|---|---|
| US2009073663A1 | United States of America | A1 | |
| WO2009035681A1 | World Intellectual Property Organization (WIPO) | A1 | |
| US7616448B2 | United States of America | B2 | |
| EP2191506A1 | European Patent Office (EPO) | A1 | |
| EP2191506A4 | European Patent Office (EPO) | A4 | |
| EP2191506B1 | European Patent Office (EPO) | B1 | |
| AT533180TThis record | Austria | T | |
| ATE533180T1 | Austria | T1 |
Numbers
- Application
- 8830081
Titles2
- German
- UMSPRITZUNG FÜR EINE ELEKTRONISCHE BAUGRUPPE
- English
- IMPRESENTATION FOR AN ELECTRONIC ASSEMBLY
Classification
- CPC, 8
- H05K3/284
- H05K3/0061
- H05K3/0064
- H05K5/0034
- H05K5/065
- H05K7/20854
- H05K2201/10189
- H05K2203/1316
- IPC, 3
- H01L23 28
- H05K5 00
- H05K5 06