AT532218T

Laser patterning of light emitting devices and patterned light emitting devices

Abstract

Since a three-dimensional pattern is constituted in a semiconducting material layer, by forming the surface of a semiconducting material layer using laser, the luminescence device which has a semiconductor light emitting element on a substrate and this substrate is provided with an optical extraction structure. A semiconducting material layer is a substrate. The surface of a semiconducting material layer is formed by irradiating a semiconducting material layer with a laser beam with sufficient energy to remove a substance from a semiconducting material layer. A laser beam is irradiated again with the level which is less than a 融蝕 threshold value by a blanket system. Etching of a substrate is performed following irradiation of the laser beam to a semiconducting material layer. Anisotropic etching of the semiconducting material layer is carried out. Pattern formation also of the mask is carried out using a laser beam, and also a semiconducting material layer is etched using a mask. The luminescence device which has a three-dimensional pattern in the semiconducting material layer of a device is also offered.

Term

Term ended

Expired 24 January 2025, 1.7 years ago.

  1. Priority
  2. Filed
  3. Granted
  4. Expired
  5. Today

16 members in 7 offices

This recordMember, by publication datePriority claim

Priority claims2

Priority claims
DocumentOfficeKindDate
81529304United States of AmericaA
2005001933United States of AmericaW

Members16

Family members, oldest first
DocumentOfficeKind
US2005227379A1United States of AmericaA1
TW200534510ATaiwan Province of ChinaA
WO2005104253A1World Intellectual Property Organization (WIPO)A1
WO2005104253A8World Intellectual Property Organization (WIPO)A8
EP1733438A1European Patent Office (EPO)A1
KR20070013292ARepublic of KoreaA
US2007037307A1United States of AmericaA1
JP2007537581AJapanA
US7384809B2United States of AmericaB2
US2008135866A1United States of AmericaA1
US7419912B2United States of AmericaB2
US7829906B2United States of AmericaB2
US2011068351A1United States of AmericaA1
EP1733438B1European Patent Office (EPO)B1
AT532218TThis recordAustriaT
US8263995B2United States of AmericaB2