Method for producing an electronic component

The invention relates to a manufacturing method of electronic component in the surface of the substrate; the electronic element comprises, is perpendicular to the substrate is at least two metal electric energy layer; the two metal electric energy layer of the arranged at the other; and at least overlapped manner of the surface SECTION area. During continuous process, wherein at least two metal electric energy level directly or edges connected on the substrate. Midspan at least two according to be tightly the first layer according to be tightly with such path layer, so of the first metal hood is in layer of the base surface, and first/width of the opposite surface SECTION area of the opposite directions of two opposite moving direction, and is parallel to the surface of the substrate is/width of grows according to claim 5 μ, and is grows/extend mm.