Method and apparatus for separating and assembling semiconductor strips

The is claimed for (400) to retain the tall and slender semiconductor strip (630) and method and apparatus of the wafer. The vacuum (500) suction of each semiconductor bottom of the wafer (400) of adjacency or edges. The cover board (400) and vacuum (500) supply in turn to (400) which are tall and slender semiconductor bar of the wafer (630). Moreover, the claimed is used to form of the tall and slender semiconductor strip (630) assembling according semiconductor material board (400) which the thin of strip (630) array a method and device. And a step further covered, further - comprising claimed is provided on the base part method, device and system for assembling tall and slender semiconductor strip (630) array.