AT520149T

A method of preparation of an epitaxial substrate

Abstract

The invention relates to a extending method for preparing substrate, especially preparing GaN, SiGe, AIN or InN extending method for substrate. An objective of the present invention claims a extending method for preparing substrate, and method of further of the influence of substrate, further economically is feasible. Target of this invention realized by the following steps: Providing bottom substrate, adding atomic material to generate the weak layered area on bottom substrate, providing mode to the level of the bottom surface of the substrate under the first temperature, in which the reinforcing layer and second high - temperature, especially from separating the bottom substrate remaining part on the bottom middle sublayer together, thereby with the pedestal according to generate the pseudo substrate, providing the homogeneous phase epitaxial layer or a hetero epitaxy layer on the substrate layer.

Term

Term ended

Expired 19 May 2024, 2.3 years ago.

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18 members in 8 offices

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Priority claims
DocumentOfficeKindDate
03291371European Patent Office (EPO)A
2004005439European Patent Office (EPO)W

Members18

Family members, oldest first
DocumentOfficeKind
EP1484794A1European Patent Office (EPO)A1
US2004255846A1United States of AmericaA1
WO2004112126A1World Intellectual Property Organization (WIPO)A1
TW200501239ATaiwan Province of ChinaA
US2005003641A1United States of AmericaA1
EP1631986A1European Patent Office (EPO)A1
KR20060055462ARepublic of KoreaA
CN1802739AChinaA
TWI269371BTaiwan Province of ChinaB
US7226509B2United States of AmericaB2
KR100746179B1Republic of KoreaB1
JP2007524222AJapanA
US7261777B2United States of AmericaB2
CN100576503CChinaC
JP4733633B2JapanB2
EP1631986B1European Patent Office (EPO)B1
AT520149TThis recordAustriaT
ATE520149T1AustriaT1