Nova Patents
AT519587T

Molding system using film heaters

Abstract

The present invention relates to an improved hot runner manifold inlet and the hot runner melt channel disposed along at least one using a thin film device comprising an active or passive thin film element of the nozzle between the nozzle and the mold manifold. Preferably, the thin film element may comprise a thin film heater to assist in adjusting the flow of the resin in the column and the melt channel to direct contact with the molten resin. Injection molding around the melt channel to enhance process control in the machine may be provided with thin-film temperature sensors, pressure sensors, and leak detectors and the like.Thin film elements, liquid, melt, injection molding, heating

Term

Term ended

Expired 8 June 2019, 7.3 years ago.

  1. Priority
  2. Filed
  3. Granted
  4. Expired
  5. Today

27 members in 7 offices

This recordMember, by publication datePriority claim

Priority claims1

Priority claims
DocumentOfficeKindDate
9638898United States of AmericaA

Members27

Family members, oldest first
DocumentOfficeKind
CA2274308A1CanadaA1
EP0963829A1European Patent Office (EPO)A1
JP2000006194AJapanA
KR20000006129ARepublic of KoreaA
US6305923B1United States of AmericaB1
US6341954B1United States of AmericaB1
EP1234651A2European Patent Office (EPO)A2
US2002182285A1United States of AmericaA1
EP1234651A3European Patent Office (EPO)A3
US6575729B2United States of AmericaB2
US2003206991A1United States of AmericaA1
EP0963829B1European Patent Office (EPO)B1
AT262403TAustriaT
ATE262403T1AustriaT1
DE69915731D1GermanyD1
US6764297B2United States of AmericaB2
US2004222209A1United States of AmericaA1
DE69915731T2GermanyT2
CA2274308CCanadaC
US2005129801A1United States of AmericaA1
US7029260B2United States of AmericaB2
US7071449B2United States of AmericaB2
KR100667992B1Republic of KoreaB1
JP2010012797AJapanA
EP1234651B1European Patent Office (EPO)B1
AT519587TThis recordAustriaT
ATE519587T1AustriaT1