A device comprising a sensor module

The present invention provides a sensor module and a method of manufacturing apparatus comprising a sensor module. The sensor module includes a package, said package comprising: a first substrate having a first functional layer; a second substrate having a second functional layer, wherein the second functional layer and the functional layer opposite the first; located at least one functional layer of the at least one sensor; and including means for aligning the first and second functional layer of solder system, wherein at least some of the joints are soldered points.