AT512490T
Methods of forming semiconductor devices including mesa structures and multiple passivation layers and related devices
Abstract
This record has no abstract on file.
Term
Term ended
Expired 18 December 2023, 2.8 years ago.
- Priority
- Filed
- Granted
- Expired
- Today
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| CN109843455A | Cited by | China | Search report |
68 members in 12 offices
Priority claims4
| Document | Office | Kind | Date |
|---|---|---|---|
| 43491402 | United States of America | P | |
| 43499902 | United States of America | P | |
| 43521102 | United States of America | P | |
| 43521302 | United States of America | P |
Members68
| Document | Office | Kind | |
|---|---|---|---|
| CA2500647A1 | Canada | A1 | |
| CA2503854A1 | Canada | A1 | |
| CA2504098A1 | Canada | A1 | |
| CA2504099A1 | Canada | A1 | |
| WO2004059706A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO2004059751A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO2004059808A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO2004059809A2 | World Intellectual Property Organization (WIPO) | A2 | |
| AU2003299748A1 | Australia | A1 | |
| AU2003301055A1 | Australia | A1 | |
| AU2003301055A8 | Australia | A8 | |
| AU2003301057A1 | Australia | A1 | |
| AU2003301057A8 | Australia | A8 | |
| AU2003301089A1 | Australia | A1 | |
| AU2003301089A8 | Australia | A8 | |
| US2004147054A1 | United States of America | A1 | |
| US2004147094A1 | United States of America | A1 | |
| US2004149997A1 | United States of America | A1 | |
| US2004152224A1 | United States of America | A1 | |
| TW200416812A | Taiwan Province of China | A | |
| TW200418085A | Taiwan Province of China | A | |
| WO2004059751A3 | World Intellectual Property Organization (WIPO) | A3 | |
| TW200423218A | Taiwan Province of China | A | |
| WO2004059808A3 | World Intellectual Property Organization (WIPO) | A3 | |
| TW200501199A | Taiwan Province of China | A | |
| WO2004059706A3 | World Intellectual Property Organization (WIPO) | A3 | |
| WO2004059809A3 | World Intellectual Property Organization (WIPO) | A3 | |
| KR20050084406A | Republic of Korea | A | |
| KR20050085290A | Republic of Korea | A | |
| KR20050085756A | Republic of Korea | A | |
| KR20050085757A | Republic of Korea | A | |
| EP1573827A2 | European Patent Office (EPO) | A2 | |
| EP1573870A2 | European Patent Office (EPO) | A2 | |
| EP1573871A2 | European Patent Office (EPO) | A2 | |
| EP1576674A2 | European Patent Office (EPO) | A2 | |
| HK1076330A1 | Hong Kong, China | A1 | |
| CN1726624A | China | A | |
| CN1729581A | China | A | |
| CN1729582A | China | A | |
| CN1729600A | China | A | |
| JP2006511942A | Japan | A | |
| JP2006511943A | Japan | A | |
| JP2006511944A | Japan | A | |
| JP2006511948A | Japan | A | |
| US7160747B2 | United States of America | B2 | |
| US2007007544A1 | United States of America | A1 | |
| EP1573870B1 | European Patent Office (EPO) | B1 | |
| AT353484T | Austria | T | |
| DE60311678D1 | Germany | D1 | |
| EP1830416A2 | European Patent Office (EPO) | A2 | |
| EP1830416A3 | European Patent Office (EPO) | A3 | |
| DE60311678T2 | Germany | T2 | |
| US7329569B2 | United States of America | B2 | |
| US2008135982A1 | United States of America | A1 | |
| US7613219B2 | United States of America | B2 | |
| US7642626B2 | United States of America | B2 | |
| CN1726624B | China | B | |
| CN1729600B | China | B | |
| TWI334620B | Taiwan Province of China | B | |
| TWI337373B | Taiwan Province of China | B | |
| TWI338320B | Taiwan Province of China | B | |
| KR101020387B1 | Republic of Korea | B1 | |
| EP1830416B1 | European Patent Office (EPO) | B1 | |
| AT512490TThis record | Austria | T | |
| KR101045160B1 | Republic of Korea | B1 | |
| JP4866550B2 | Japan | B2 | |
| JP5183012B2 | Japan | B2 | |
| EP1573871B1 | European Patent Office (EPO) | B1 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 6124077
Titles2
- German
- VERFAHREN ZUR HERSTELLUNG VON HALBLEITERVORRICHTUNGEN MIT MESASTRUKTUR UND MEHREREN PASSIVIERUNGSSCHICHTEN
- English
- METHOD FOR PRODUCING SEMICONDUCTOR DEVICES WITH MESASTRUCTURE AND SEVERAL PASSIVATION LAYERS
Classification
- CPC, 14
- H01L33/145
- H01S5/30
- H01S5/021
- H01S5/0421
- H01S5/0425
- H01S5/04254
- H01S5/22
- H01S5/2205
- H01S5/2206
- H01S5/2214
- H01S5/2231
- H01S5/2275
- H01S5/32341
- H01S2301/176
- IPC, 9
- H01S5 028
- C30B1 00
- H01L21 00
- H01L33 14
- H01S5 042
- H01S5 22
- H01S5 223
- H01S5 227
- H01S5 323