Method of manufacturing a hermetically sealed glass package

The present invention relates to a method for manufacturing a hermetically sealed package and heating the frit disposed in a pattern between two substrates using a laser to form a hermetic seal connecting the two substrate with the heated glass material, characterized in that Enters the frit pattern, to trace the frit pattern, traces the frit pattern a portion of Li, and the step to clear the direction to the laser to exit the frit pattern; When the laser enters the frit pattern, the method comprising: selecting an initial laser power is insufficient to heat the frit to form the hermetic seal; Increasing the laser power over a first section of the frit pattern to the target laser power at least sufficient to heat the frit to form the hermetic seal; And The laser is for reducing the laser power over a second section of the frit pattern until to heat the glass material for forming the hermetic seal prior to exiting the frit pattern the laser power is insufficient It is achieved by a step.