AT505067T

Circuit board unit and method for production thereof

Abstract

The invention relates to the circuit board device and manufacturing method thereof. The circuit board and circuit board layer is dialectic constant (8); 19); And the cover is provided with an is in the installation device SMD (12); 14, The18, The21) Conductive path (10). Circuit board layer is dialectic constant (8); 19) Having such that: theThe thickness is determined to make the SMD (12); 18) Diffusion anticipated quantity of the efficient a circuit board dialectic constant (8); 19) And a double-operational. The circuit board unit further - comprising: Is arranged on the circuit board layer is dialectic constant (8); 19) Of electrically insulating dialectic constant (9); , A plug with a high heat dissipation SMD with the good heat conductivity and insulating material is made (12); 18) Arranged on the insulating dialectic constant (9) plug (15); And is arranged on the insulating dialectic constant (9) and socket (15) and cooling plate (16).

Term

Projected expiry 27 October 2026.

  1. Priority and filed
  2. Granted
  3. Today
  4. Projected expiry

1 legal event, as the office reported them to INPADOC

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Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRERRER