AT501491T

Personal document and method for producing it

Abstract

The Invention relates to a personal document with an integrated contactless readable chip, the one made of a laminate consisting of a chip film, the chip film on the structure of the chip covering substrate and a the chip film back covering Covering, wherein the chip film a to a thickness d ≦ 50 microns bevozugt, d ≦ 30 .mu.m, more preferably d ≦ 20 microns thinned chip with an integrated circuit and a polymeric carrier film comprises, apart from which contact terminals, both on the structure side as well as on the back the chip is applied. The chip is on both sides with the carrier film each connected by a coupling agent, the molecules of a comprise first chemically functional group that preferably with the Semiconductor material of the chip surface and reacts there a konvalente bond forms, and a second functional group own which bevozugt with the polymer matrix of the carrier film reacts with the carrier film, the Substrate and the cover layer each have compatible polymers, which are mixed with each other, especially soluble in each and the chip connected to an antenna provided on the substrate is.

Term

1.2 yearsleft in the term

Expires 11 December 2027.

  1. Priority
  2. Filed
  3. Granted
  4. Today
  5. Expires

16 members in 8 offices

This recordMember, by publication datePriority claim

Priority claims2

Priority claims
DocumentOfficeKindDate
102006059454GermanyA
2007063697European Patent Office (EPO)W

Members16

Family members, oldest first
DocumentOfficeKind
DE102006059454A1GermanyA1
WO2008071697A2World Intellectual Property Organization (WIPO)A2
WO2008071697A3World Intellectual Property Organization (WIPO)A3
KR20090088407ARepublic of KoreaA
EP2102798A2European Patent Office (EPO)A2
CN101558418AChinaA
US2010051702A1United States of AmericaA1
JP2010513999AJapanA
EP2102798B1European Patent Office (EPO)B1
AT501491TThis recordAustriaT
ATE501491T1AustriaT1
DE502007006700D1GermanyD1
CN101558418BChinaB
US8302870B2United States of AmericaB2
JP5383499B2JapanB2
KR101463515B1Republic of KoreaB1