AT497480T
Structure and bonding method for a flip-chip MEMS device package
Abstract
This record has no abstract on file.
Term
Term ended
Expired 13 November 2023, 2.9 years ago.
- Priority
- Filed
- Granted
- Expired
- Today
16 members in 8 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 20020070876 | Republic of Korea | A |
Members16
| Document | Office | Kind | |
|---|---|---|---|
| KR20040042924A | Republic of Korea | A | |
| US2004106294A1 | United States of America | A1 | |
| JP2004160654A | Japan | A | |
| CN1507023A | China | A | |
| EP1431242A2 | European Patent Office (EPO) | A2 | |
| KR100447851B1 | Republic of Korea | B1 | |
| TW200425360A | Taiwan Province of China | A | |
| US6884650B2 | United States of America | B2 | |
| TWI234832B | Taiwan Province of China | B | |
| EP1431242A3 | European Patent Office (EPO) | A3 | |
| CN1260796C | China | C | |
| JP4012874B2 | Japan | B2 | |
| EP1431242B1 | European Patent Office (EPO) | B1 | |
| AT497480TThis record | Austria | T | |
| ATE497480T1 | Austria | T1 | |
| DE60335936D1 | Germany | D1 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 3257155
Titles2
- German
- VERBINDUNGSSTRUKTUR UND VERBINDUNGSVERFAHREN FÜR FLIP-CHIP MEMS VERKAPSELUNG
- English
- CONNECTION STRUCTURE AND CONNECTION METHOD FOR FLIP-CHIP MEMS ASSEMBLY
Classification
- CPC, 19
- B81C1/00269
- B81C2203/035
- H01L24/81
- H01L2224/0401
- H01L2224/05009
- H01L2224/13009
- H01L2224/81801
- H01L2224/9202
- H01L2924/01005
- H01L2924/01006
- H01L2924/01023
- H01L2924/01033
- H01L2924/01078
- H01L2924/01079
- H01L2924/01082
- H01L2924/01087
- H01L2924/01322
- H01L2924/014
- H01L2924/1461
- IPC, 6
- B23K1 20
- B23K101 40
- B81B7 00
- B81C1 00
- H01L21 60
- H01L23 02