Emi shielding and thermal management assemblies including frames and covers with multi-position latching

According to various aspects of the invention, an exemplary embodiment is formed of the assembly to provide heat dissipation board level EMI shielding and one or more electrical components. Another aspect relates to components of such assemblies. Another aspect relates to a method of using EMI shielding and thermal management assemblies. Additional aspect relates to a method and its components, method of preparing the EMI shielding and thermal management assemblies.EMI shielding, heat dissipation, a cover, a frame, a thermal interface