AT487164T

Method and apparatus for developing photoresist patterns

Abstract

(57) The system and equipment for the yield and the line width characteristic for summary liquefied polymer and other materials which have been improved are explained. The method for making precipitation of a development reactant into the minimum by reducing a rapid change of pH, The above-mentioned polymer is rinsed using the above-mentioned developing solution of developing at least one copy of the polymer layer on a substrate using the developing solution of a certain quantity, and the amount of; additions, and the change of pH with after that rapid is minimized so that control is possible. ; It ranks second, It includes rinsing the above-mentioned polymer using another liquid of a certain quantity. The equipment for improving yield and a line width control characteristic by making into the minimum liquid collision power over the polymer layer on a substrate which should be developed, The nozzle containing two or more rinse agent lead pipes combined with the rinse manifold and the; above-mentioned development manifold which suited so that two or more developing solution lead pipes and; rinse agents which were combined with the development manifold and the; above-mentioned development manifold which suited so that a developing solution might be supplied might be supplied, and; is provided. The above-mentioned liquid manifold and the above are also acquired, and in these, as compared with intersection or the nominal external width of the above-mentioned nozzle which can be attained without arranging alternately, one manifold is alternately arranged so that the external width of the above-mentioned nozzle may be decreased. This system and method offer the process-induced defect which decreased, the improved yield by the number of particles, and the advantage containing the improved critical size (CD) control ability.

Term

No projected expiry on record.

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42 members in 10 offices

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Priority claims
DocumentOfficeKindDate
10073898United States of AmericaP
22106098United States of AmericaA
9920115United States of AmericaW

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DocumentOfficeKind
WO0016163A2World Intellectual Property Organization (WIPO)A2
AU5802399AAustraliaA
WO0016163A3World Intellectual Property Organization (WIPO)A3
US6248171B1United States of AmericaB1
EP1114355A2European Patent Office (EPO)A2
KR20010089163ARepublic of KoreaA
JP2002525653AJapanA
US2002187442A1United States of AmericaA1
WO03030228A2World Intellectual Property Organization (WIPO)A2
AU2002334796A1AustraliaA1
US2003102385A1United States of AmericaA1
WO03030228A3World Intellectual Property Organization (WIPO)A3
US6669779B2United States of AmericaB2
US6689215B2United States of AmericaB2
US2004062876A1United States of AmericaA1
KR20040049318ARepublic of KoreaA
EP1440459A2European Patent Office (EPO)A2
JP2005505919AJapanA
CN1605112AChinaA
US2005095368A1United States of AmericaA1
JP3708437B2JapanB2
TWI249657BTaiwan Province of ChinaB
KR100560180B1Republic of KoreaB1
US2007059651A1United States of AmericaA1
EP1440459B1European Patent Office (EPO)B1
US7208262B2United States of AmericaB2
US2007089671A1United States of AmericaA1
AT359600TAustriaT
DE60219503D1GermanyD1
EP1440459B8European Patent Office (EPO)B8
US7255975B2United States of AmericaB2
CN100349254CChinaC
DE60219503T2GermanyT2
KR100814452B1Republic of KoreaB1
CN101251719AChinaA
US7625692B2United States of AmericaB2
JP4414758B2JapanB2
EP1114355B1European Patent Office (EPO)B1
AT487164TThis recordAustriaT
DE69942913D1GermanyD1
EP1114355B8European Patent Office (EPO)B8
CN101251719BChinaB