AT464654T

PREPARATION OF A RELAXED SiGe LAYER ON AN INSULATOR

Abstract

This invention public has a for in insulated body (74) of ease SiGe (SGOI) Shang formed strain Si or strain SiGe of method, in semiconductor lining end of Shang growth sustained variable Si1-xGex layer (20) and extension Si1-yGey layer, in by in Si1-yGey layer (30) in the injected hydrogen (70), to formed rich hydrogen defects layer, through chemical machinery polished smooth surface, through heat treatment will two a lining end of bond in together, and in rich hydrogen defects layer separation two a bond of lining end of. Can be separated through the CMP on the substrate surface (75), smooth surface for epitaxial deposition on the other layers.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
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15 members in 11 offices

This recordMember, by publication datePriority claim1 more office is in the list below

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Priority claims
DocumentOfficeKindDate
67584000United States of AmericaA
0104321United KingdomW

Members15

Family members, oldest first
DocumentOfficeKind
WO0227783A1World Intellectual Property Organization (WIPO)A1
AU9202401AAustraliaA
TW512487BTaiwan Province of ChinaB
US6524935B1United States of AmericaB1
KR20030033078ARepublic of KoreaA
EP1320883A1European Patent Office (EPO)A1
JP2004510350AJapanA
CN1489786AChinaA
CN1215550CChinaC
KR100532338B1Republic of KoreaB1
MY126089AMalaysiaA
JP4045187B2JapanB2
EP1320883B1European Patent Office (EPO)B1
AT464654TThis recordAustriaT
DE60141843D1GermanyD1