Process for packaging components and packaged components
Abstract
The invention relates to wafer level packaging technology and a element of the technical package. A volume of this invention is to provide the type: processAn high rate of finished product, suitable for connecting/and micro-mechanical and realizing improved from the function of heat mechanical and. To process of this invention, the front switching board and a chip, a base substrate is divided the adult area and connection area; the area is extended the function area of the situations; the connection area of the contact is groove transistor. Connection element and connection area of the base body is different of thin is wherein the area body or the connection area.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
21 members in 10 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 10356885 | Germany | A | |
| 2004012917 | European Patent Office (EPO) | W |
Members21
| Document | Office | Kind | |
|---|---|---|---|
| WO2005055310A2 | World Intellectual Property Organization (WIPO) | A2 | |
| DE10356885A1 | Germany | A1 | |
| TW200524066A | Taiwan Province of China | A | |
| DE10356885B4 | Germany | B4 | |
| WO2005055310A3 | World Intellectual Property Organization (WIPO) | A3 | |
| IL175341A0 | Israel | A0 | |
| EP1700337A2 | European Patent Office (EPO) | A2 | |
| KR20060126636A | Republic of Korea | A | |
| CN1890789A | China | A | |
| JP2007513507A | Japan | A | |
| US2008038868A1 | United States of America | A1 | |
| EP1700337B1 | European Patent Office (EPO) | B1 | |
| AT461525TThis record | Austria | T | |
| ATE461525T1 | Austria | T1 | |
| US7700397B2 | United States of America | B2 | |
| DE602004026112D1 | Germany | D1 | |
| IL175341A | Israel | A | |
| US2010187669A1 | United States of America | A1 | |
| JP2012156551A | Japan | A | |
| US8309384B2 | United States of America | B2 | |
| JP5329758B2 | Japan | B2 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 4797893
Titles2
- German
- PROZESS ZUM KAPSELN VON KOMPONENTEN UND GEKAPSELTE KOMPONENTEN
- English
- PROCESS TO CAPSULE COMPONENTS AND CAPSULATED COMPONENTS
Classification
- CPC, 47
- H01L24/05
- H01L21/50
- H01L23/481
- H01L24/29
- H01L24/45
- H01L24/48
- H01L24/83
- H01L2224/0401
- H01L2224/04042
- H01L2224/05554
- H01L2224/05556
- H01L2224/16
- H01L2224/29111
- H01L2224/2919
- H01L2224/45124
- H01L2224/45144
- H01L2224/48463
- H01L2224/48599
- H01L2224/48699
- H01L2224/8385
- H01L2924/00014
- H01L2924/01005
- H01L2924/01006
- H01L2924/01013
- H01L2924/01014
- H01L2924/01015
- H01L2924/01019
- H01L2924/01022
- H01L2924/01029
- H01L2924/01033
- H01L2924/01049
- H01L2924/0105
- H01L2924/01061
- H01L2924/01074
- H01L2924/01078
- H01L2924/01079
- H01L2924/01082
- H01L2924/0132
- H01L2924/014
- H01L2924/0665
- H01L2924/07802
- H01L2924/10253
- H01L2924/10329
- H01L2924/14
- H01L2924/1461
- H01L2924/15788
- H01L21/78
- IPC, 3
- H01L21 50
- H01L21 58
- H01L23 48