Light emitting devices having current blocking structures and methods of fabricating light emitting devices having current blocking structures

In the wire bond pad having a current just below the blocking mechanism is provided with the manufacturing method of light-emitting elements and the light emitting element. The current cut-off mechanism may be a conductive region in an active area of ​​the device decreases. The current cut-off mechanism can be a damage region contact is formed thereon. The current cut-off mechanism may be a Schottky contact between the ohmic contact and the active region of the device. A semiconductor junction such as a PN junction, can also be provided between the ohmic contact and the active region.