Flip chip Interconnection structure and method of obtaining the same

(57) A summary and subject The flip chip junction structure which joins a substrate to a chip firmly at little pressure and a low temperature is offered. Solution means By the vamp on the integrated circuit which it is the flip chip junction structure formed by mechanical junction of the 1st element and the 2nd element, and the 1st element becomes from the material which has low surrender strength and high fracture growth, and which can change that it is flexible and, Flip chip junction structure of having the unevenness which the 1st element changes into the surface of the 2nd element in bottom 可塑 of pressurization, flows into it, and forms mechanical tabling.