Chip stack cutter devices for displacing chips in a chip stack and chip-stacking apparatuses including such cutter devices, and related methods

Cutting device stacks, comprising: a base member configured to slide along a channel of a chip stack carrier; one displacement member coupled movably to the base member and configured so as to extend below a plurality of chips in a stack of chips carried by a chip stack carrier; a sensor configured to output a signal when the sensor detects a presence of a selected maximum number of chips to move under the motion of the displacement with respect to the base member; and responsive to energy for displacing a number of chips in a stack of chips carried in a channel of a carrier stacks, wherein the sensing device energy configured to selectively move the displacement member relative to the member device base in response to the signal emitted by the sensor.