Nova Patents
AT454483T

Atomic layer deposition using metal amidinates

Abstract

The metal film deposited in the thermopol thickness of the sleeve and. Metal copper film is alternatively of N, N ' - reaction of each of the formula acetamidine copper (I) and hydrogen on the substrate. Cobalt metal film is alternatively of N, N ' - reaction of each of the formula acetamidine cobalt (II) and compound of the heating. The nitride is 50-150 oxide and a second are hydrogen formed with ammonia or a steam. The film of with an average thickness of the sleeve and. The suitable magnetic application of the microelectronic device and magnetic of component a heat resistance the electric heating.

Term

No projected expiry on record.

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42697502United States of AmericaP
46336503United States of AmericaP
0336568United States of AmericaW

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AT454483TThis recordAustriaT
DE60330896D1GermanyD1
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