Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed fingers

Grounding spring for electromagnetic interference (EMI) suppression is interposed between the heat sink and the printed circuit board (PCB). The grounding spring comprises a conductive material which is provided with an opening in the base, the opening and the heat sink is in thermal contact with an electronic module mounted on PCB through. Base is in electrical contact with the circumferential surface of a heat sink, and is jointed spring fingers are electrical contact with conductive pads on the PCB to extend from the base. During compression, the movement of the tip of each spring finger is substantially limited to the z-axis. Thus, the tip can be precisely controlled even when the grounding spring to its final position is to accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that can slide off the conductive pads less.