AT446822T
Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
Abstract
This record has no abstract on file.
Term
Term ended
Expired 27 August 2023, 3.1 years ago.
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126 members in 10 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 23097002 | United States of America | A |
Members126
| Document | Office | Kind | |
|---|---|---|---|
| US2002025759A1 | United States of America | A1 | |
| US2002025760A1 | United States of America | A1 | |
| US2002025763A1 | United States of America | A1 | |
| WO0218099A2 | World Intellectual Property Organization (WIPO) | A2 | |
| AU8859101A | Australia | A | |
| US2002123299A1 | United States of America | A1 | |
| WO0218099A3 | World Intellectual Property Organization (WIPO) | A3 | |
| WO03001581A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO03001582A2 | World Intellectual Property Organization (WIPO) | A2 | |
| AU2002316303A1 | Australia | A1 | |
| US2003054729A1 | United States of America | A1 | |
| US6551935B1 | United States of America | B1 | |
| US2003087525A1 | United States of America | A1 | |
| KR20030036740A | Republic of Korea | A | |
| EP1314194A2 | European Patent Office (EPO) | A2 | |
| US2003109198A1 | United States of America | A1 | |
| US2003129927A1 | United States of America | A1 | |
| US6602117B1 | United States of America | B1 | |
| WO03076134A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU2003212478A1 | Australia | A1 | |
| WO03001581A3 | World Intellectual Property Organization (WIPO) | A3 | |
| WO03001582A3 | World Intellectual Property Organization (WIPO) | A3 | |
| US2003226764A1 | United States of America | A1 | |
| CN1468446A | China | A | |
| US2004014318A1 | United States of America | A1 | |
| KR20040010773A | Republic of Korea | A | |
| TW200402342A | Taiwan Province of China | A | |
| US2004043582A1 | United States of America | A1 | |
| US2004043629A1 | United States of America | A1 | |
| US2004043705A1 | United States of America | A1 | |
| KR20040021616A | Republic of Korea | A | |
| JP2004507899A | Japan | A | |
| WO2004020148A1 | World Intellectual Property Organization (WIPO) | A1 | |
| WO2004020545A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU2003262996A1 | Australia | A1 | |
| AU2003265767A1 | Australia | A1 | |
| EP1399956A2 | European Patent Office (EPO) | A2 | |
| EP1399957A2 | European Patent Office (EPO) | A2 | |
| CN1516894A | China | A | |
| JP2004531649A | Japan | A | |
| JP2004531899A | Japan | A | |
| TW200422386A | Taiwan Province of China | A | |
| EP1480784A1 | European Patent Office (EPO) | A1 | |
| KR20040104480A | Republic of Korea | A | |
| US6830500B2 | United States of America | B2 | |
| US2005020004A1 | United States of America | A1 | |
| US2005020192A1 | United States of America | A1 | |
| US2005034999A1 | United States of America | A1 | |
| US2005035000A1 | United States of America | A1 | |
| EP1532222A1 | European Patent Office (EPO) | A1 | |
| EP1536919A1 | European Patent Office (EPO) | A1 | |
| KR20050057082A | Republic of Korea | A | |
| KR20050057088A | Republic of Korea | A | |
| JP2005519478A | Japan | A | |
| US2005153556A1 | United States of America | A1 | |
| CN1646264A | China | A | |
| CN1678708A | China | A | |
| CN1688411A | China | A | |
| CN1706035A | China | A | |
| JP2005537640A | Japan | A | |
| JP2005537647A | Japan | A | |
| KR100598477B1 | Republic of Korea | B1 | |
| US7074113B1 | United States of America | B1 | |
| US7078308B2 | United States of America | B2 | |
| US7094131B2 | United States of America | B2 | |
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| US2006199351A1 | United States of America | A1 | |
| US2006208322A1 | United States of America | A1 | |
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| US2006234604A1 | United States of America | A1 | |
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| US2006249397A1 | United States of America | A1 | |
| US2006252268A1 | United States of America | A1 | |
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| CN1291462C | China | C | |
| US7153195B2 | United States of America | B2 | |
| US7153410B2 | United States of America | B2 | |
| KR100663662B1 | Republic of Korea | B1 | |
| US7160176B2 | United States of America | B2 | |
| US2007037490A1 | United States of America | A1 | |
| US7192335B2 | United States of America | B2 | |
| TWI278370B | Taiwan Province of China | B | |
| KR20070049690A | Republic of Korea | A | |
| US2007111641A1 | United States of America | A1 | |
| US7220166B2 | United States of America | B2 | |
| KR100720849B1 | Republic of Korea | B1 | |
| KR100722181B1 | Republic of Korea | B1 | |
| KR100730908B1 | Republic of Korea | B1 | |
| EP1536919B1 | European Patent Office (EPO) | B1 | |
| AT376477T | Austria | T | |
| DE60317080D1 | Germany | D1 | |
| CN100356523C | China | C | |
| EP1875987A2 | European Patent Office (EPO) | A2 | |
| US2008045009A1 | United States of America | A1 | |
| EP1875987A3 | European Patent Office (EPO) | A3 | |
| DE60317080T2 | Germany | T2 | |
| CN100413037C | China | C |
Showing 100 of 126
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 7020164
Titles2
- German
- VERFAHREN UND VORRICHTUNG ZUR ELEKTROMECHANISCHEN UND/ODER ELEKTRISCH-CHEMISCH-MECHANISCHEN ENTFERNUNG LEITFÄHIGEN MATERIALS VON EINEM MIKROELEKTRONISCHEN SUBSTRAT
- English
- METHOD AND DEVICE FOR ELECTROMECHANICAL AND / OR ELECTRICAL-CHEMICAL-MECHANICAL REMOVAL OF CONDUCTIVE MATERIAL FROM A MICROELECTRONIC SUBSTRATE
Classification
- CPC, 5
- B23H5/08
- H01L21/302
- B24B37/042
- C25F3/02
- C25F7/00
- IPC, 11
- B23H5 08
- B24B1 00
- B24B7 19
- B24B37 04
- B24B51 00
- C25F3 02
- C25F3 30
- C25F7 00
- H01L21 304
- H01L21 3063
- H01L21 3205