AT436091T
Wafer scale bonding of protective caps
Abstract
The present invention is the method of attaching the sequence (134) of a cap to the wafer (144) which consists of the semiconducting material which has two or more micro fabrication devices (146). This method prepares the sequence (134) of the 1st cap in the one side of a wafer (144) almost simultaneous, pastes up the sequence (134) of a cap on a wafer (144), and includes dividing a wafer into each package (148) after that.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
36 members in 7 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| PR244801 | Australia | A | |
| 0200008 | Australia | W |
Members36
| Document | Office | Kind | |
|---|---|---|---|
| AUPR244801A0 | Australia | A0 | |
| US2002088537A1 | United States of America | A1 | |
| WO02056367A1 | World Intellectual Property Organization (WIPO) | A1 | |
| US2003092245A1 | United States of America | A1 | |
| EP1356510A1 | European Patent Office (EPO) | A1 | |
| US6716666B2 | United States of America | B2 | |
| US2004079862A1 | United States of America | A1 | |
| US2004082104A1 | United States of America | A1 | |
| US2004082105A1 | United States of America | A1 | |
| US2004082110A1 | United States of America | A1 | |
| US2004082115A1 | United States of America | A1 | |
| US2004082119A1 | United States of America | A1 | |
| US2004101992A1 | United States of America | A1 | |
| US2004121517A1 | United States of America | A1 | |
| AU2002216845B2 | Australia | B2 | |
| JP2004523106A | Japan | A | |
| US6812062B2 | United States of America | B2 | |
| AU2004220750A1 | Australia | A1 | |
| AU2004220751A1 | Australia | A1 | |
| US2005042802A1 | United States of America | A1 | |
| AU2004220750B2 | Australia | B2 | |
| AU2004220751B2 | Australia | B2 | |
| US6977189B2 | United States of America | B2 | |
| US6979599B2 | United States of America | B2 | |
| US6982189B2 | United States of America | B2 | |
| US6989292B2 | United States of America | B2 | |
| US7008819B2 | United States of America | B2 | |
| US7026176B2 | United States of America | B2 | |
| EP1356510A4 | European Patent Office (EPO) | A4 | |
| US7126216B2 | United States of America | B2 | |
| US7173332B2 | United States of America | B2 | |
| JP3962688B2 | Japan | B2 | |
| EP1356510B1 | European Patent Office (EPO) | B1 | |
| AT436091TThis record | Austria | T | |
| ATE436091T1 | Austria | T1 | |
| DE60232857D1 | Germany | D1 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 2729352
Titles2
- German
- BEFESTIGEN VON SCHUTZKAPPEN AUF WAFER-EBENE
- English
- ATTACHING CAPS AT WAFER LEVEL
Classification
- CPC, 12
- B81C1/00333
- B29C33/0022
- B29C33/3842
- B29C43/36
- B29C2035/0822
- B29C2043/503
- B81C2203/0109
- B81C2203/0127
- H01L21/50
- H01L2224/48463
- H01L2924/1461
- Y10S257/924
- IPC, 16
- B29C33 38
- B29C33 40
- B29C35 08
- B29C43 36
- B29C45 12
- B81B7 00
- H01L21 00
- H01L21 44
- H01L21 48
- H01L21 50
- H01L21 822
- H01L21 8238
- H01L23 02
- H01L23 04
- H01L23 10
- H01L23 12