Nova Patents
AT436091T

Wafer scale bonding of protective caps

Abstract

The present invention is the method of attaching the sequence (134) of a cap to the wafer (144) which consists of the semiconducting material which has two or more micro fabrication devices (146). This method prepares the sequence (134) of the 1st cap in the one side of a wafer (144) almost simultaneous, pastes up the sequence (134) of a cap on a wafer (144), and includes dividing a wafer into each package (148) after that.

Term

No projected expiry on record.

  1. Priority
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36 members in 7 offices

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Priority claims
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PR244801AustraliaA
0200008AustraliaW

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US2002088537A1United States of AmericaA1
WO02056367A1World Intellectual Property Organization (WIPO)A1
US2003092245A1United States of AmericaA1
EP1356510A1European Patent Office (EPO)A1
US6716666B2United States of AmericaB2
US2004079862A1United States of AmericaA1
US2004082104A1United States of AmericaA1
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EP1356510A4European Patent Office (EPO)A4
US7126216B2United States of AmericaB2
US7173332B2United States of AmericaB2
JP3962688B2JapanB2
EP1356510B1European Patent Office (EPO)B1
AT436091TThis recordAustriaT
ATE436091T1AustriaT1
DE60232857D1GermanyD1