Integrated passive devices fabricated utilizing multi-layer, organic laminates

The present invention contains an organic element incorporable into the layered substrate produced with an organic material. This passive component is either a surface mount element (SMD) or a ball grid array (BGA) form, and can be manufactured in one on the circuit board. As an exception method, this passive component can be constituted as SMD of a stand-alone type, or BGA / chip scale package (CSP) so that it can mount on a layered substrate, a ceramic carrier, or a silicon platform with the form of an accumulation passive component. This passive component contains a side cover part in two sides of an SMD form at four sides of a BGA/CSP form. A side wall cover electrode may be external, or may be a nest.