Electronic module having canopy-type carriers

The multi-chip module improved comprising a main circuit board; the board with electric property interconnection welded with the array of plate; the IC encapsulating units are, wherein the lower part of the array. The IC encapsulating units comprises a pair of IC package, which are sealed arranged in the sealing type pro and reverse. The sealing device is installed in the main circuit board on one side or two sides. The first basic embodiment of this invention uses a sheet-shaped package substrate, a carrier with a pair of a planar surface. The plane of combined the electric property of the bonding pad. By using the bonding pad the plane of the pin of interconnection package, so the IC encapsulation surface of each main planar surface, form IC encapsulating units. Capable of multiple sets of, wherein each other embodiments of the invention, comprising in the embodiments, the support pin capable of directly laminated on the pin of IC package.