Adhesive transfer device

A method for manufacturing an adhesive substrate repositionable from a selected substrate, and that reposicionablemente adheres the adhesive substrate repositionable to a contact surface, said method comprising: selecting the selected substrate to produce in said adhesive substrate repositionable, as desired by the user; provide a device adhesive transfer comprising: a base substrate a layer of repositionable adhesive pressure sensitive, disposed on said base substrate; a layer of pressure sensitive permanent adhesive provided adjacent to said repositionable adhesive layer opposite the base substrate; and a structure that provides a release surface, said release surface peelable applied on said permanent adhesive layer opposite to said repositionable adhesive layer and said base substrate being, to cover said permanent adhesive layer; being the nature of the release surface such that said base substrate and the structure providing said release surface can be separated from each other to separate said release surface of said layer of permanent adhesive, and leave both adhesive layers mentioned on said substrate base, with said permanent adhesive layer uncovered; said adhesive layers so that, after an exposed portion of said permanent adhesive layer has been adhesively bonded to selected substrate, said base substrate and the selected substrate can be separated from each other to separate said base substrate from said adhesive layer being arranged repositionable adhesive layer and leave both mentioned on said selected substrate with said repositionable adhesive layer uncovered; moving said release surface of said adhesive layer separating to leave both adhesive layers on said selected substrate mentioned with said repositionable adhesive layer uncovered; applying said permanent adhesive layer discovered on said selected substrate, as desired by the user, to adhesively bond said permanent adhesive layer with said selected substrate; moving said base substrate and said selected substrate relatively apart from each other, to leave portions of both adhesive layers on said selected substrate with said repositionable adhesive layer uncovered, and removing said base substrate of said portions of both adhesive layers; selecting a desired contact surface by the user; applying the repositionable adhesive layer uncovered on said selected substrate with said contact surface so that said selected said contact surface with the repositionable adhesive layer substrate reposicionablemente adhere, allowing the user to remove the selected substrate from the contact surface and adhere reposicionablemente the selected substrate with another contact surface or the same contact surface as desired by the user.