AT425277T

Method of forming a sputtering target assembly and assembly made therefrom

Abstract

This record has no abstract on file.

Term

Term ended

Expired 20 October 2023, 2.9 years ago.

18 members in 10 offices

This recordMember, by publication datePriority claim

Priority claims1

Priority claims
Document	Office	Kind	Date
41991602	United States of America	P	2002-10-21

Members18

Family members, oldest first
Document	Office	Kind
US2004079634A1	United States of America	A1	2004-04-29
WO2004038062A2	World Intellectual Property Organization (WIPO)	A2	2004-05-06
AU2003284294A1	Australia	A1	2004-05-13
WO2004038062A3	World Intellectual Property Organization (WIPO)	A3	2004-12-09
TW200502416A	Taiwan Province of China	A	2005-01-16
EP1556526A2	European Patent Office (EPO)	A2	2005-07-27
KR20050084863A	Republic of Korea	A	2005-08-29
CN1726301A	China	A	2006-01-25
JP2006508239A	Japan	A	2006-03-09
US7467741B2	United States of America	B2	2008-12-23
EP1556526B1	European Patent Office (EPO)	B1	2009-03-11
AT425277TThis record	Austria	T	2009-03-15
ATE425277T1	Austria	T1	2009-03-15
DE60326621D1	Germany	D1	2009-04-23
CN100526499C	China	C	2009-08-12
TWI315747B	Taiwan Province of China	B	2009-10-11
KR101047722B1	Republic of Korea	B1	2011-07-08
JP4768266B2	Japan	B2	2011-09-07

2 legal events, as the office reported them to INPADOC

Over the term

Point at a mark for the event

Events

Legal events, newest first
	Event	Code
2011-01-15	Ceased due to non-payment of the annual feeCeasedREN	REN
2009-09-15	Publication of translation of european patent specificationUEP	UEP