Die attach area cut-on-fly method and apparatus

Method of applying respective transponders to at least one electrically conductive element to form a plurality of circuit components, moving said at least one electrically conductive element continuously in a path, being provided each of said circuit components a first conductive portion, a second conductive portion and a conductor space (36) between the first and second conductive parts, the transponder to be fixed to the first and second conductive parts forming a bridge over the conductor space (36) therebetween being arranged, the method comprising: determining the location of the driver space (36) in one of the plurality of circuit components while the at least one electrically conductive member is moved along said path; placing a respective space adjacent to the driver (36) transponder, while said at least one electrically conductive element moves along said path, based on the determined location of said conductive gap (36); and electrically coupling respective portions of each respective transponder to respective first and second conductive parts through the conductor space (36) to secure the respective transponder thereto.