Providing current control over wafer borne semiconductor devices using overlayer patterns
Abstract
Liquid matter is bus is a substrate (1240) and at least one with source block (1240) and at least one surface layer (1240) semiconductor chip (1240) for providing chip parasite current control method. The electric control device (1240) realize by a method for rotating the connecting element (1215) is formed, wherein the pattern (1240) comprises to form is provided with infusion and/or the sacrifice of layer is an active device the connecting element (1215) represents. The current is wound with the contact element (1215) and active device related active area (1260). The is claimed is used for wafer-level of semiconductor device integrated older of the WLBI) method and system. The is a WLBI method and system, wafer-level current control system is important.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
59 members in 10 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 31191601 | United States of America | P |
Members59
| Document | Office | Kind | |
|---|---|---|---|
| CA2457675A1 | Canada | A1 | |
| CA2457680A1 | Canada | A1 | |
| CA2457685A1 | Canada | A1 | |
| CA2457690A1 | Canada | A1 | |
| CA2457691A1 | Canada | A1 | |
| WO03017325A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO03017326A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO03017335A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO03017352A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO03017353A2 | World Intellectual Property Organization (WIPO) | A2 | |
| AU2002323125A1 | Australia | A1 | |
| AU2002323126A1 | Australia | A1 | |
| AU2002331069A1 | Australia | A1 | |
| AU2002331074A1 | Australia | A1 | |
| AU2002356039A1 | Australia | A1 | |
| WO03017326A3 | World Intellectual Property Organization (WIPO) | A3 | |
| WO03017352A3 | World Intellectual Property Organization (WIPO) | A3 | |
| WO03017353A3 | World Intellectual Property Organization (WIPO) | A3 | |
| WO03017335A3 | World Intellectual Property Organization (WIPO) | A3 | |
| WO03017325A3 | World Intellectual Property Organization (WIPO) | A3 | |
| KR20040030103A | Republic of Korea | A | |
| KR20040030104A | Republic of Korea | A | |
| KR20040030105A | Republic of Korea | A | |
| KR20040030106A | Republic of Korea | A | |
| KR20040030107A | Republic of Korea | A | |
| EP1417499A2 | European Patent Office (EPO) | A2 | |
| EP1417500A2 | European Patent Office (EPO) | A2 | |
| EP1417501A2 | European Patent Office (EPO) | A2 | |
| EP1421396A2 | European Patent Office (EPO) | A2 | |
| EP1423872A2 | European Patent Office (EPO) | A2 | |
| JP2005500686A | Japan | A | |
| JP2005500688A | Japan | A | |
| JP2005500690A | Japan | A | |
| JP2005500691A | Japan | A | |
| CN1568429A | China | A | |
| CN1568431A | China | A | |
| CN1568432A | China | A | |
| CN1568433A | China | A | |
| CN1568539A | China | A | |
| US2005024076A1 | United States of America | A1 | |
| JP2005510044A | Japan | A | |
| US2006097337A1 | United States of America | A1 | |
| US2007029549A1 | United States of America | A1 | |
| US7190184B2 | United States of America | B2 | |
| US2007117242A1 | United States of America | A1 | |
| KR100780059B1 | Republic of Korea | B1 | |
| EP1417500B1 | European Patent Office (EPO) | B1 | |
| AT414911TThis record | Austria | T | |
| ATE414911T1 | Austria | T1 | |
| DE60229954D1 | Germany | D1 | |
| CN100533165C | China | C | |
| US7662650B2 | United States of America | B2 | |
| US7700379B2 | United States of America | B2 | |
| US2010264511A1 | United States of America | A1 | |
| US8039277B2 | United States of America | B2 | |
| US8129253B2 | United States of America | B2 | |
| JP5009487B2 | Japan | B2 | |
| JP5009488B2 | Japan | B2 | |
| EP1417501B1 | European Patent Office (EPO) | B1 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 2752818
Titles2
- German
- VERFAHREN ZUR DURCHFÜHRUNG DES EINBRENNENS ELEKTRONISCHER VORRICHTUNGEN AUF NICHT VEREINZELTE HALBLEITERSCHEIBEN
- English
- METHOD FOR CARRYING OUT BURNING OF ELECTRONIC DEVICES TO UNAUTHORIZED SEMICONDUCTOR DISCS
Classification
- CPC, 9
- G01R31/275
- G01R31/2831
- G01R31/2863
- G01R31/2872
- G01R31/2874
- G01R31/2884
- H01S5/0021
- H01S5/005
- H01S5/423
- IPC, 7
- G01R31 27
- G01R31 28
- G01R31 316
- H01L21 66
- H01S5 042
- H01S5 183
- H01S5 42