Method and device for modifying the position of electronic components

The invention relates to a method for changing the position of electronic components, for example chips

Pick-up tool simultaneously picked up, held, transported and simultaneously laid down at a storage position, for example at an intermediate position or a processing position, or kept ready in a further pick-up position for a further change in position. The invention also relates to a device for carrying out the method.

It is known that when electronic components, such as chips, are fitted, these are individually picked up with a pick-up tool at a component pick-up position, brought to the bonding point by means of a positioning device and there in contact with the substrate. The components can be provided at the receiving position, for example, in containers specially provided for this purpose, in so-called waffle packs or the like, the components being arranged regularly. However, it is also known that the components are provided laminated onto a carrier film.

Furthermore, from US Pat. No. 5,040,291 A, an assembly device for SMD components is known. Several SMD components are picked up at the same time and transported to a test station (SCOT station). In this "SCOT" station, the SMD components are aligned and, if necessary, a test is carried out.

From JP 03-211117 A a device is known which picks up two components at the same time and also puts them down. This device is suitable for sorting machines.

Another SMD assembler is known from US Pat. No. 5,491,888. With this device, the head can be moved in the xy plane via two spindles that are normal to each other.

Another SMD assembler is known from US Pat. No. 5,911,456. With this device, the head with the suction needles is fixed.

From JP 11-135989 A an SMD assembler for a multiple receptacle is known.

For example, US Pat. No. 4,875,285 A discloses methods for increasing the placement performance, according to which components are picked up with the aid of a special placement head, a so-called turret head, which can pick up several components one after the other, i.e. sequentially, at the component pickup position. The time-consuming travel path to the processing position, in particular to the

Bond position. At this position, the components are deposited again individually or sequentially. As a result, the travel from the component pick-up position to the processing or Run through bond position for several chips only once. The disadvantage of this method, however, is that both the component pick-up process and the component placement process are sequential and therefore slow. In addition, such a turret head is designed so that upon rotation of the

Turret, the pick-up tools are always ready to pick up the component at the same xy position. To accommodate components that are distributed in the xy plane, the positioning device must move for each component. The same applies analogously to the component deposit. This travel path therefore also leads to considerable time losses.

The object of the invention is to create a method of the type cited at the outset which, on the one hand, avoids the above disadvantages and, on the other hand, allows more efficient production with at least the same quality standard.

The object is achieved by the invention.

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The method according to the invention is characterized in that the relative arrangement of the components to one another is changed between the pick-up position and the deposit position, the relative arrangement of the components being changed or changed during the pick-up by changing the relative position in the pick-up tool, if necessary during transport. that in the case of an intermediate positioning of the components, this intermediate position is both the storage and the pick-up position and the components picked up at the pick-up position are stored or held ready at the intermediate position and are picked up again with a changed relative position to one another, in groups or individually, the relative The arrangement of the components during the recording is changed by changing the relative position in the intermediate position. With this invention it is possible for the first time to achieve parallelization of the component feed, for example to a diebonder. This enables fast and efficient and therefore more economical production.

According to the invention, the components can be fed in in one step, but a feed with the interposition of at least one intermediate position is also possible. One and the same tool can be used to feed to the processing position or switch to another receiving tool in the intermediate position.

By changing the relative arrangement of the components to one another between the receiving position and the depositing position, the component or chip depositing at the processing or bonding position can advantageously take place in a pitch that is independent of the grid division of the components or chips at the component receiving position. The mentioned pitch is the relative distance between the individual chips. Of course, the concept of changing the relative arrangement of the components to one another also includes a rotation of the components. This means that the production-related grid can be flexibly addressed.

The components picked up at the pick-up position can be stored or held ready at an intermediate position at the same time and picked up again with a changed relative position to one another, together, in groups or individually. The relative position of the components to one another can be changed in the intermediate position. If, for example, the components are kept ready in the intermediate position with a pick-up tool, the transfer of a grid on the component mount into another grid on the

Component storage can be done by changing the components to another pick-up tool. Each pick-up tool has its own, in particular fixed, predetermined grid, the grid being changed by corresponding group pick-up of the components. The advantage of this procedure lies in the fact that the chip can be picked up from an intermediate position much more quickly than, for example, the chip picked up from one

Carrier film. This results in a considerable gain in time with the parallel chip removal from the film with subsequent sequential transfer in comparison to the sequential removal from the film.

However, the components picked up at the pick-up position together, in groups or individually can also be deposited or kept ready at the deposition position jointly or in groups. It is therefore also entirely possible that a grid transfer is achieved in that groups of components are placed sequentially at the processing position. Thus, only every second component provided on the pick-up tool could be deposited at the same time in a depositing process for the bonding position. In the second step, the remaining components are positioned at the same time.

Of course, the grid layout can also be taken into account when picking up the components, for example by picking up non-adjacent components arranged on the film in accordance with the grid layout at the processing position.

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However, the relative arrangement of the components during the pick-up can also be changed by changing the relative position in the pick-up tool, possibly during transport. This advantageous embodiment uses the transport route or the transport time to change the relative position of the components to one another. A further increase in the number of cycles can thus be achieved.

The relative arrangement of the components can also be changed during the recording by changing the relative position in the intermediate position. This can be carried out, for example, via movable storage surfaces for the individual components, so-called microactuators, provided at the intermediate position.

According to a special feature of the invention, the components and / or the relative arrangement of the components to one another on the receiving tool and / or in the intermediate position are measured, in particular optically. If there are several components on a recording tool, they can all be measured simultaneously with one camera. The components can be measured from above with the substrate camera at once or by moving the camera. But it is also quite conceivable that with the help of a special recording tool, a so-called transparent flip tool, the components can also be inspected from below with the rear-view camera. The position and / or the angle of the components to one another and / or of the components to another coordinate system can be determined by the image processing software. A change in the relative position of the components to one another can thus be automated.

According to a development of the invention, the components are provided on a

When lifting the film with the pick-up tool from the rear side, it is simultaneously punched out or lifted with needles. As a result, the chips held by the pick-up tools can be detached from the carrier film without any problems.

According to a further feature of the invention, each component is removed with its own arrangement of needle and a suction needle or gripper provided in the receiving tool. This means that parallelization is also provided during the recording process through individual, parallel support.

According to a further feature of the invention, each receiving tool or each Saugna35 del or each gripper is adapted to the individual height of the component. It can thus be ensured that manufacturing-related height tolerances, such as those of pick-up tools or chips, are compensated for and that the entire arrangement of components is picked up and deposited properly.

The object of the present invention is also achieved by a device for carrying out the method.

The device according to the invention for carrying out the method is characterized in that at least one pick-up tool is provided which consists of at least two suction needles or grippers. With this device according to the invention, it is possible for the first time to pick up at least two components at the same time in at least one pick-up position and / or put them down in at least one pick-up position at the same time. It is therefore possible for the first time to achieve parallelization of the component feed, for example to a diebonder. With this equipment, which can be manufactured economically, quick and efficient production is possible.

According to a special feature of the invention, the position and / or the angle of the suction needles or grippers provided in a receiving tool can be changed with respect to one another. This allows the relative arrangement of the components to one another between the receiving position and the storage position can be changed. This can be done, for example, with an umbrella type i5

AT 414 077 Β gen mechanics can be achieved. For this purpose, the suction needles or the grippers are movable

Connections connected to a central guide rod. When opening this

Mechanics, if necessary during the travel path, the radial distance changes and thus the grid division of the components that is specified during the recording.

According to a particular embodiment of the invention, at least one suction needle or a gripper is movably and / or rotatably mounted in the receiving tool. The individual suction needles or grippers can of course also change their distance from one another by moving them in a plane. It is also possible to rotate the suction needles or the grippers.

According to a special feature of the invention, the receiving tool is arranged in a positioning device. Positioning devices are known per se, so that there is no need to go into more detail about them. A configuration according to the invention with a pick-up tool according to this invention advantageously does not entail any great development effort. Such a tool can be adapted and used quickly.

According to another special feature of the invention, the pick-up tool is arranged in an arm which can be pivoted through 180 °. Tools that are arranged in an arm that can be swiveled through 180 ° are also called flip tools. The simultaneous acceptance of several components can also be realized with a flip tool. This flip tool can also be scalable in at least one dimension. The components can be processed further from the flip tool, i.e. removed from the flipper individually or simultaneously with a fixed or also scalable pick-up tool and brought to the processing or bonding position with or without intermediate steps.

According to a further development of the invention, the pick-up tool deposits the components at an intermediate position, the position and / or the angles to one another being or being changeable. The components can be placed in the intermediate position on a clipboard that can align the components. For example, so-called microactuators, that is to say movable storage surfaces, can align the components in position and angle to one another and / or as a whole to another coordinate.

According to a further embodiment of the invention, each suction needle or each gripper or each needle can be adjusted to the height of the component to be picked up. For example, in order to compensate for minor unevenness of the wafer, caused by an uneven height of the individual components, the piercing needles can be mounted on springs and / or the removal tools can be sprung.

According to a further feature of the invention, the receiving tool and / or the film area on which the components to be removed are arranged can be heated. In this way, for special types of film, the adhesion of the components to the film can be reduced locally and thus the quality of the component acceptance can be increased.

The invention is explained in more detail using exemplary embodiments that are shown in the drawing.

Show it:

1 shows a pick-up tool of a device for changing the position of electronic components at a pick-up position and the transport,

2 shows the pick-up tool during transport,

3 shows a pick-up tool in the pick-up position,

4 shows the pick-up tool in an intermediate position,

5 shows a pick-up tool in the pick-up position of an intermediate position,

6 shows a variant of a pick-up tool in the pick-up position,

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7 shows a transfer of the components from one pick-up tool to a further pick-up tool and

8 and 9 a measurement of the components.

At the outset, it should be noted that in the embodiment described, the same parts are provided with the same reference numerals or the same component designations, and the disclosures contained in the entire description can be transferred accordingly to the same parts with the same reference numerals or the same component designations. The location details chosen in the description, such as above, below, to the side, etc. refer to the figures immediately described and shown and are to be transferred accordingly to the new position in the event of a change in position.

According to FIG. 1, a pick-up tool 1 of a device for changing the position of electronic components 2 is shown at a pick-up position. Such changes in position of electronic components 2 are necessary, for example, when assembling printed circuit boards, in particular ceramic substrates. Especially for the process of gluing, the so-called bonding, these components 2, preferably arranged on a film 3, are picked up with a pick-up tool 1 at a pick-up position, held and transported to a processing position.

In order to achieve efficient and, in particular, economical production, the pick-up tool 1 has at least two suction needles or grippers 4. With these suction needles or grippers 4, at least two components 2 are picked up at at least the pick-up position or at least two components 2 are simultaneously deposited at the deposit position. the

In this case, the components 2 could be stored or picked up sequentially. Of course, several components 2, for example in groups, can be picked up and deposited at the same time.

In the receiving position, when the components 2 are removed from a film 3 on which the

A device 5 with needles 6 is provided on the side facing away from the component, the needles 6 supporting the lifting of the component 2 from the film 3. The needles 6 can pierce through the film 3 and, synchronously with the pick-up process, lift the component 2 in the direction of the suction needle or gripper 4.

Since the components 2 to be processed have, among other things, different height dimensions, the needles 6, but of course also the suction needles or grippers 4, can be adjusted in height by means of springs 7, for example. For each component 2 that is picked up, a separate arrangement of needle 6 and a suction needle or gripper 4 provided in the pick-up tool 1 can be provided.

The quality of the component removal can also be increased by heating the receiving tool 1 and / or the film area on which the components 2 to be removed are arranged. As a result of the heating, the adhesion of the components 2 to the film 3 can be locally reduced for special types of film.

The components 2 picked up at the pick-up position with the pick-up tool 1 are then transported to the processing position. This transport is indicated by the arrow 8.

Since the stored components 2, which are provided on the film 3 or possibly in a matrix-like container, lie close to one another and are applied far apart in the processing position on the substrate, the relative arrangement of the components 2 between the receiving position and the storage position is changed .

For this change in the relative position in the receiving tool 1, which is preferably

AT 414 077 Β takes place according to FIG. 2 during transport, at least one suction needle or gripper is movably and / or rotatably mounted in the receiving tool 1. The linear mobility of the

The suction needle or the gripper 4 can be reached via an indicated guide slot 9. the

The rotatability of the suction needles or the grippers 4 is indicated by the arrow 10. At the placement position, the components 2 are placed at a greater distance from one another. This change in the distance between the components 2 is called scaling. The path that is covered during the change is the scaling path.

The pick-up tool 1 can be arranged in a positioning device which is state-of-the-art in the field of Chipio handling. The positioning device itself can have at least three degrees of freedom of movement, in the x, y and z directions. This normally allows the chip from the receiving position, for example from its storage on a

Foil, to be brought to the processing position, preferably to the bonding point. However, it is quite conceivable that the positioning device has four freedom of movement, namely the three directions indicated above and also rotation. However, it is entirely conceivable that the positioning device has only three degrees of freedom of movement, namely in the y, z directions and rotation. The correction movement in the x direction guides the substrate.

According to FIG. 3, the pick-up tool 1 picks up at least two components 2 at the same time at the pick-up position with the suction nipples or grippers 4. The recording process is supported by the device 5 with the needles 6. Since the suction needles or grippers 4 are fixedly arranged in this pick-up tool 1, it is not possible to change the relative arrangement of the components 2 to one another during transport.

In this embodiment variant, the pick-up tool 1 places the components 2 in an intermediate position according to FIG. 4. The intermediate position consists of movable support surfaces 11, so-called microactuators. After the components 2 have been deposited on these support surfaces 11, the pick-up tool 1 moves back to its starting position, to the pick-up position.

To change the relative arrangement of the components 2 to one another, these movable support surfaces 11 are moved apart in the xy plane, in accordance with the desired or predetermined processing grid at the processing position.

Another pick-up tool 12, the suction needles or grippers 4 of which are set to the processing grid in a fixed manner, picks up the components 2 according to FIG. 5 and transports them to the processing position.

Of course, it is also within the scope of the invention if the components 2, which are simultaneously received in the receiving position and / or simultaneously deposited in the intermediate position, are in the

Intermediate position can be picked up again one after the other or in groups by a pick-up tool 12 with a changed relative arrangement to one another.

According to FIG. 6, a receiving tool 13 is provided which is mounted in an arm 14 which can be pivoted through 180 °. Such a tool is called a flip tool. The suction needles or grippers 4 arranged in this pick-up tool 13 are movably mounted and pick up the components 2 in the pick-up position. During the pivoting of the arm 14 by 180 °, the relative arrangement of the components 2 is changed, for example, by moving the suction needles or grippers 4 apart.

Thus, the pick-up tool 13 holds the components 2 according to FIG. 7 in an intermediate position in a grid that has been modified for pick-up. Another pick-up tool 15 picks up the components 2 directly from the pick-up tool 13. This pick-up tool 15 has rotatable suction needles or grippers 4, so that the angles of the components 2 with respect to one another are changed by a rotation during transport to the processing position.

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It is of course within the meaning of the invention that the components 2 picked up simultaneously by the pick-up tool 15 are deposited at the processing position in groups or also individually. Likewise, a sequential recording with correspondingly short travel paths and a simultaneous filing can take place accordingly.

Another - not shown - possibility of changing the relative position of the components 2 to one another would be to provide the pick-up tool 1, which is arranged in a positioning device, or the pick-up tool 13, which is attached to the pivotable arm 14, with an umbrella-like mechanism, on which the suction needles or grippers 4 are arranged. This umbrella-like mechanism could consist of movable connections to the suction needles 4, which are connected with a ring. This ring could be on a central

Guide linkage be slidably mounted. If the suction needles 4 are now mounted centrally at one end in the region of the guide rod, and the ring is moved, the free end of the suction needle could make radial changes in distance or angle. With these special

Constructions, the components are independently scalable in every dimension.

However, it is also within the scope of the invention to provide two pick-up tools 13 in the form of flip tools. At least one such receiving tool 13 can have an umbrella-like mechanism. In such a case, the components are provided by a receiving tool 13 in the intermediate position and taken over directly by a second receiving tool 13. The relative arrangement of the components 2 to one another can be changed in the first receiving tool 13 or in the second receiving tool 13. However, the relative arrangement of the components 2 to one another can also be changed in both receiving tools 13.

Of course, with a special construction of the pick-up position and / or processing position, only one pick-up tool 13 in the form of a flip tool could be used.

According to FIG. 8, the components 2 are measured with a camera 16. If there are several components 2 on a recording tool 1, then all of them can be measured simultaneously with the camera 16. The position and / or the angle of the components 2 with respect to one another can be determined by image processing software. By specifying the processing grid in the software, the relative arrangement of the components 2 in the pick-up tool 1 can also be changed automatically with a corresponding control or regulation.

However, it is also possible, in particular when using a recording tool 13 in the form of a flip tool, to measure the components 2 from above with the substrate camera.

According to FIG. 9, the components 2 can also be measured with a camera 16 in the intermediate position when they are arranged on a clipboard 17. With a transparent clipboard 17, measurement from below is also possible.

Analogous to the above, the change in the relative arrangement of the components 2 to one another can be automated on the basis of the measurement and corresponding software.

Finally, it should be pointed out that in the exemplary embodiment described above, individual parts are disproportionately enlarged or shown schematically in order to improve the understanding of the solution according to the invention.