AT400894T
Cooled electronic assembly and method for cooling a printed circuit board
Abstract
This record has no abstract on file.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
6 members in 4 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 15537105 | United States of America | A |
Members6
| Document | Office | Kind | |
|---|---|---|---|
| EP1734578A1 | European Patent Office (EPO) | A1 | |
| US2006285300A1 | United States of America | A1 | |
| US7230832B2 | United States of America | B2 | |
| EP1734578B1 | European Patent Office (EPO) | B1 | |
| AT400894TThis record | Austria | T | |
| DE602006001691D1 | Germany | D1 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 6076155
Titles2
- German
- GEKÜHLTE ELEKTRONISCHE ANORDNUNG UND METHODE ZUM KÜHLEN EINER LEITERPLATTE
- English
- GEKÜHLTE ELEKTRONISCHE ANORDNUNG UND METHODE ZUM KÜHLEN EINER LEITERPLATTE
Classification
- CPC, 2
- H01L23/473
- H01L2924/0002
- IPC, 1
- H01L23 473