AT376201T
Stripping and cleaning compositions for microelectronics
Abstract
An aqueous composition for cleaning microelectronic substrates and minimizing aluminum corrosion, the composition comprising (1) water and (2) at least one of (a) hypophosphite ammonium (b) phosphite ammonium, or (c) hypophosphorous acid or phosphorous acid and an ammonium salt.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
26 members in 18 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 49611003 | United States of America | P | |
| 54897604 | United States of America | P |
Members26
| Document | Office | Kind | |
|---|---|---|---|
| CA2536159A1 | Canada | A1 | |
| WO2005019939A1 | World Intellectual Property Organization (WIPO) | A1 | |
| TW200536936A | Taiwan Province of China | A | |
| NO20061247L | Norway | L | |
| EP1664935A1 | European Patent Office (EPO) | A1 | |
| KR20060076764A | Republic of Korea | A | |
| IL173664D0 | Israel | D0 | |
| US2006154839A1 | United States of America | A1 | |
| CN1839355A | China | A | |
| BRPI0413657A | Brazil | A | |
| JP2007503115A | Japan | A | |
| EP1664935B1 | European Patent Office (EPO) | B1 | |
| AT376201TThis record | Austria | T | |
| DE602004009595D1 | Germany | D1 | |
| PT1664935E | Portugal | E | |
| DK1664935T3 | Denmark | T3 | |
| PL1664935T3 | Poland | T3 | |
| ES2293340T3 | Spain | T3 | |
| DE602004009595T2 | Germany | T2 | |
| MY139624A | Malaysia | A | |
| JP4522408B2 | Japan | B2 | |
| IL173664A | Israel | A | |
| US7928046B2 | United States of America | B2 | |
| KR101056544B1 | Republic of Korea | B1 | |
| TWI354020B | Taiwan Province of China | B | |
| CN1839355B | China | B |
2 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Change of the company nameEEFA | EEFA | |
| Publication of translation of european patent specificationUEP | UEP |
Numbers
- Application
- 4779284
Titles2
- German
- ABLÖS- UND REINIGUNGSZUSAMMENSETZUNGEN FÜR DIE MIKROELEKTRONIK
- English
- REMOVAL AND CLEANING COMPOSITIONS FOR MICROELECTRONICS
Classification
- CPC, 15
- C11D3/0073
- C11D7/04
- C11D3/046
- C11D3/30
- C11D7/10
- C11D7/32
- C11D7/3209
- C11D11/0047
- G03F7/425
- G03F7/426
- H01L21/02063
- H01L21/02071
- H01L21/6704
- C11D7/06
- C11D1/62
- IPC, 7
- G03F7 42
- C11D7 04
- C11D7 06
- C11D7 32
- C11D11 00
- H01L21 00
- H01L21 02