Multi-layer circuit assembly and process for preparing the same

Provides a method and a multi-layer circuit support group of manufacturing multilayer circuit set supports the method is made. A method of providing a substrate (a), wherein at least part comprises multiple circuit; the area is 500 to 10,000) is a square liquid (75-1550/square centimetre) and circuit; density(b) is formed in the middle alarm exposing face dielectric layer Quantum Coating the conformality layer,The middle alarm surface coating the metal layer with (c). Processing order of connection to circuit design of a.