AT367458T
Apparatus and method for depositing thin film on wafer using atomic layer deposition
Abstract
This record has no abstract on file.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
15 members in 8 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 20000035100 | Republic of Korea | A |
Members15
| Document | Office | Kind | |
|---|---|---|---|
| EP1167569A1 | European Patent Office (EPO) | A1 | |
| KR20020001073A | Republic of Korea | A | |
| JP2002069651A | Japan | A | |
| KR100332313B1 | Republic of Korea | B1 | |
| US2002052097A1 | United States of America | A1 | |
| US2002094689A1 | United States of America | A1 | |
| SG90250A1 | Singapore | A1 | |
| TW531796B | Taiwan Province of China | B | |
| US6573184B2 | United States of America | B2 | |
| US6579372B2 | United States of America | B2 | |
| JP3631984B2 | Japan | B2 | |
| EP1167569B1 | European Patent Office (EPO) | B1 | |
| AT367458TThis record | Austria | T | |
| DE60129380D1 | Germany | D1 | |
| DE60129380T2 | Germany | T2 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 1304922
Titles2
- German
- VORRICHTUNG UND VERFAHREN ZUM AUFTRAGEN EINER DÜNNSCHICHT AUF EINEN WAFER DURCH ABSCHEIDUNG VON ATOMAREN SCHICHTEN
- English
- DEVICE AND METHOD FOR APPLYING A THIN LAYER ON A WAFER BY SEPARATING ATOMIC LAYERS
Classification
- CPC, 7
- C23C16/45544
- C23C16/45548
- C23C16/45561
- C23C16/45565
- C23C16/45574
- Y10S438/935
- Y10T137/4673
- IPC, 5
- C23C16 44
- C23C16 455
- C23C16 54
- H01L21 28
- H01L21 285