Fluxless flip chip interconnection

The invention claims a conversion chip method of joint chip and substrate. The heat compresses the adapter is used to aim at chip and substrate, and a to contact with a chip and a substrate solder the metal convex member is placed the same base. Wafer in the heater is adapter and memory module is before the soldering lug (temperature from wherein non-working surface. And achieves the solder bump is a reflow temperature, the rotor is released. The pin of the is higher than the reflow temperature multiple seconds, a middle favor metal convex moistening and related. The metal cap composed of such as dysprosium and metal precious is 100mhz or 120mhz the metal member the surface, for preventing metal member (typically comprising a high conductive and high-activity metal, such as copper) happen to oxidation and lower high-temperature during reflow operation.