Semiconductor device and its manufacturing method

The semiconductor device, wherein the load is arranged on the part of the semiconductor chip base plate element mounting surface, is provided with for enlarging the shell of the auxiliary appliance's concave part and matching the convex block mounting part; the convex block mounting the state, and back side of the shell surface of one side of asymmetrical. On the other side, wherein the shell is section surface of one side of the stator installation the surface; the arranged above shell the section of the surface opposite side convex mounting the width is wider than. On the other side, the convex a part of mounting part supports the duress is arranged in the section of the groove part, so that the number of hooking is the auxiliary appliance's clamp part; fixing the auxiliary device for loading and unloading free connected to the shell is. On the other side, and memory circuit in the semiconductor chip.