Opto-electronic device integration

A method of manufacturing comprises at least two on upper active device mixed chip method to electronic chip. The method of ceiling active device and electronic chip combination of electronic chip contact points, at least part of active device contact point and at least part electronic chip contact point connected with aim, at least one each contact point of some of active device contact point is an electric corresponding electronic chip contact point. The method comprising generating side, the side of the substrate with the first side and second side and first sides active device contact point basic superposition's the light the limit opening, the sidewall's active device contact point is first side passes through the substrate are extended to the substrate second side; With the side conductive to form an active device contact points to which are ends of the conductive paths; A conductive material of the active optical device chip second side least one ends are connected to the position and at least part electronic chip contact point the aim at.