AT358192T

Method and apparatus for treating a substrate

Abstract

The method for processing at least a surface, wherein at least a light flexible of the processing chamber, the pressure of the processing chamber is relatively low, and shot of the source to produce the plasma at least plasma, or processing, wherein the plasma is the source (3) and/or at least one of on the treatment liquid supply source to the substrate surface of the motion. The invention further relates to a method for treating at least a surface, wherein the device is provided with the processing chamber and at least one plasma is the source, wherein at least plasma is the source (3) and/or at least one of on the treatment liquid supply source of the carrier which is.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
  4. Today

17 members in 11 offices

This recordMember, by publication datePriority claim1 more office is in the list below

Priority claims1

Priority claims
DocumentOfficeKindDate
1022155Netherlands (Kingdom of the)A

Members17

Family members, oldest first
DocumentOfficeKind
NL1022155C2Netherlands (Kingdom of the)C2
WO2004053190A1World Intellectual Property Organization (WIPO)A1
AU2003296050A1AustraliaA1
KR20050100599ARepublic of KoreaA
EP1604049A1European Patent Office (EPO)A1
CN1738923AChinaA
JP2006509907AJapanA
US2006231031A1United States of AmericaA1
EP1604049B1European Patent Office (EPO)B1
AT358192TThis recordAustriaT
DE60312902D1GermanyD1
ES2283848T3SpainT3
DE60312902T2GermanyT2
KR100895913B1Republic of KoreaB1
CN100489155CChinaC
US7645495B2United States of AmericaB2
JP4578979B2JapanB2