Thermosetting poly(phenylene ether)

A terminated polyphenyl ether resin composition according steps (1) and (2) is formed: (1) Polyphenylether compound (PPE), at least one part, preferably substantially all hydroxyl groups and a olefinically non-degree of the saturated (carbon-carbon double bond) compound reaction, comprising olefinically non-degree of the saturated compound can be further with the unsaturated monomer (an end terminated PPE) reaction; (2) When the unsaturated monomer composition. Wherein the composition comprises polymerization catalyst, flame-retardant compound and fibre reinforcing component and. Wherein the composition can be solidified to form an alloy, which is formed by the copper layer coated the circuit board.